Ultrasonic vibration bonding machine
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United States of America Patent
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-
Jan 2, 2001
Issued Date -
N/A
app pub date -
Dec 14, 1999
filing date -
Jan 6, 1999
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An ultrasonic vibration bonding machine which can simplify a suction passage structure. A resonator has a suction passage at the maximum vibration amplitude point where a bonding working portion is provided, the positions of the pads of a circuit board mounted on a mounting unit and the positions of the pads of a semiconductor chip absorbed and adsorbed to the bonding working portion are measured to align the pads accurately, and then the pads are bonded together.
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