Thin film magnetic head with contoured surface
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United States of America Patent
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Dec 26, 2000
Issued Date -
N/A
app pub date -
May 18, 1999
filing date -
Oct 31, 1996
priority date (Note) -
Expired
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Abstract
A method of fabricating thin film magnetic heads on a thin film substrate uses a chemical-mechanical contouring (CMC) step after completion of the fundamental thin film head structure to form a curved surface on the substrate for the individual thin film magnetic heads of a substantial plurality of heads on a thin film substrate. A special CMC process utilizes a soft polishing pad, applying mechanical contouring motion at a slow speed, typically on the order of 1/3 a typical conventional CMP rotational speed, and at a relatively high pressure, typically two to three times a typical conventional CMP applied pressure.
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