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Abstract

The invention relates to a method for the production of a MOS-controlled power semiconductor component (30), which power semiconductor component (30) comprises, in a common substrate (31), a plurality of component cells which are arranged next to one another and are connected in parallel. A bipolar transistor formed by a collector region (33) of a first conductivity type, a superior base region (32) of a second conductivity type and an emitter region (37) of the first conductivity type, which emitter region is incorporated from above into the base region (32), is present in each component cell (59). A MOS channel structure (39, 42, 43) for controlling the bipolar transistor is provided on the emitter side, which MOS channel structure (39, 42, 43) comprises a source region (43) of the second conductivity type, which source region lies above the emitter region (37), a channel region (42) of the first conductivity type, which channel region as arranged on the edge side of the emitter region (37) between the source region (43) and the base region (32), and a gate electrode (39) which is arranged in an insulated manner above the channel region (42). Simple setting of the current density in the event of a short circuit and of the hole bypass resistance without additional process complexity is achieved by virtue of the fact that the channel width of the MOS channel structure (39, 42, 43) is structured and the structuring of the channel width of the MOS channel structure (39, 42, 43) is effected indirectly by means of one of the other mask steps used in the production process of the component.

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First Claim