Thermally conductive interface layers
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United States of America Patent
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Dec 26, 2000
Grant Date -
N/A
app pub date -
May 14, 1999
filing date -
May 14, 1999
priority date (Note) -
Expired
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Abstract
An improved interface pad or layer for use in combination with solid state electronic components adapted to be interposed along a heat dissipating path between the electronic device and a mounting chassis or heat-sink surface. The interface pads comprise a polyphenylsulfone binder or matrix blended with a particulate solid such as alumina, boron nitride, graphite, silicon carbide, diamond, metal powders, and mixtures or blends thereof. Advantageous formulations include up to 45% alumina. Another advantageous formulation includes between 10% and 20% by weight of boron nitride, balance polyphenylsulfone.
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