Photosetting conductive paste
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United States of America Patent
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Dec 26, 2000
Grant Date -
N/A
app pub date -
Sep 29, 1999
filing date -
Sep 30, 1998
priority date (Note) -
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Abstract
There is provided a photosetting conductive paste that has a surface resistance of no greater than 200 m.OMEGA./sq. upon curing by light irradiation. The photosetting conductive paste comprises conductive powder and a photosetting resin composition in specific amounts. The conductive powder contains dendritic conductive powder and scaly conductive powder at 80% or greater of the total conductive powder, the dendritic conductive powder having a mean particle size of 0.05-1.0 .mu.m, a specific surface area of 0.5-5.0 m.sup.2 /g, and the scaly conductive powder having a mean particle size of 1.0-10.0 .mu.m and a specific surface area of 0.5-5.0 m.sup.2 /g, wherein the weight ratio of the dendritic conductive powder and scaly conductive powder is 6/40-95/5. There is also provided a method of forming an antenna for a radio frequency identification medium that comprises printing the conductive paste on a substrate in an antenna-shaped pattern and curing it.
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