Double side grinding apparatus and double side polishing apparatus

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United States of America Patent

PATENT NO 6165054
SERIAL NO

09252083

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Abstract

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A double side grinding apparatus and a double side polishing apparatus, with a narrow tolerance range, reduces pitching errors, and ensures a sufficient level of rigidity against the force of reaction to machining, while enhancing positioning accuracy. The double side grinding apparatus or a double side polishing apparatus includes a plurality of guideways for supporting and shifting main spindles, and these plural guideways on end define a geometric center matched with the center of gravity of the main spindles. The number of the guideways is preferably three in order not to obstruct the mounting and removal of a workpiece.

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Patent Owner(s)

Patent OwnerAddress
SUMITOMO HEAVY INDUSTRIES LTD1-1 OSAKI 2-CHOME SHINAGAWA-KU TOKYO 1416025 JAPAN
SUPER SILICON CRYSTAL RESEARCH INSTITUTE CORPANNAKA-SHI GUNMA-KEN 379-0125

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Abe, Kohzo Gumma, JP 4 91
Hara, Kazutoshi Kanagawa, JP 11 217
Isobe, Sho Kanagawa, JP 1 7
Iwase, Akio Ehime, JP 35 718
Masaki, Ryuzo Ehime, JP 1 7
Nagata, Hiroshi Ehime, JP 144 984
Tomita, Yoshiyuki Kanagawa, JP 16 244

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