Zero insertion force sockets using negative thermal expansion materials
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Dec 26, 2000
Grant Date -
N/A
app pub date -
Feb 12, 1999
filing date -
Feb 12, 1999
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A socket device for receiving a connection pin is disclosed, the socket device including a substrate having an upper surface. The socket device includes a connection pad disposed on the upper surface and a first layer disposed on the upper surface and on the connection pad. The first layer includes material having an overall positive coefficient of thermal expansion. The socket device includes a second layer disposed on the first layer. The second layer includes material having an overall negative coefficient of thermal expansion. The socket device also includes a contact hole formed in the first and second layers exposing a portion of the connection pad.
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