Thermal link device for a cryogenic machine
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United States of America Patent
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-
Dec 26, 2000
Grant Date -
N/A
app pub date -
Mar 29, 1999
filing date -
Mar 31, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Thermal link device for use between an end surface of a cold finger of a cryogenic machine, at cryogenic temperature when in use, and a load, comprising: a plate confronting said end surface, for connection with the load, mechanically separate from the end surface and defining a condensation and vaporization gap with said end surface, a capillary pumping element in said gap, a flexible wall defining an enclosure accommodating said gap and surrounding at least said end surface and a portion of a cold finger which is close to said end surface, and gas means in said enclosure, said gas means including at least one gas having a condensation temperature selected responsive to a cryogenic temperature to be given to the load.
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