Solder material and electronic part using the same
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United States of America Patent
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Dec 12, 2000
Grant Date -
N/A
app pub date -
May 12, 1998
filing date -
May 23, 1997
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An object of this invention is to provide a solder material capable of, when joining an electronic component to a substrate with the solder material, improving heat fatigue resistance thereof and reducing damage of Ni film interposed therebetween. A solution of this invention is to assemble an electronic part by soldering a semiconductor device with a substrate using solder balls made of a solder material containing from 0.01 to 4.99% by weight of Fe; from 0.01 to 4.99% by weight of Ni, total thereof being from 0.02 to 5.0% by weight; from 0.1 to 8.0% by weight of at least one of Ag and In; from 0 to 70% by weight of Pb, balance containing Sn and unavoidable impurity.
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