Method and apparatus for fabricating semiconductor device
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Dec 12, 2000
Issued Date -
N/A
app pub date -
Nov 16, 1998
filing date -
Nov 8, 1995
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
There is provided a method for fabricating semiconductor devices including resin packages sealing semiconductor elements and external connection terminals respectively resin projections formed on the resin packages and metallic film parts provided to the resin projections. The semiconductor elements are mounted to a lead frame having recess portions located in positions corresponding to positions of the resin projections, metallic film parts being provided in the recess portions. The semiconductor elements are electrically connected to the metallic film parts. The resin packages that seal the semiconductor elements and gate portions are integrally formed with the resin packages. The lead frame is etched so that the resin packages are separated from the lead frame together with the metallic layer parts. The resin packages are attached to an adhesive tape provided to a frame and being used as a carrier.
First Claim
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Cited Art Landscape
Patent Citation Ranking
- 172 Citation Count
- H01L Class
- 98.23 % this patent is cited more than
- 25 Age