Core metal soldering knob flip-chip technology
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United States of America Patent
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Nov 28, 2000
Grant Date -
N/A
app pub date -
Aug 4, 1997
filing date -
Nov 17, 1994
priority date (Note) -
Expired
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Abstract
The invention relates to a solder bump of an inhomogeneous material compoion for connecting contact pad metallizations of different electronic components or substrates in flip-chip technology, as well as to a method of making such a solder bump. A solder bump consists of a space defining high-melting solder bump core and a layer of a preferably low-melting solder material deposited thereon. The preconditions required for soldering, such as solder deposition, bump height and soldering temperature are thus all combined in the solder bump.
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