Method for creating a hermetic seal and package made thereby
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United States of America Patent
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Nov 28, 2000
Grant Date -
N/A
app pub date -
Apr 24, 1998
filing date -
Apr 25, 1997
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method for creating hermetic seals in semiconductor packages is provided. The method includes the applying a sealing glass to ceramic layers and placing a ceramic tape layer there between. The assemblage is then laminated and fired, or sintered, to marry the material layers together to form a hermetic seal. The hermetic seal made thereby may be incorporated into a wide variety of semiconductor devices including packages and feedthroughs.
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