Lean, high conductivity, relaxation-resistant beryllium-nickel-copper alloys
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United States of America Patent
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Nov 28, 2000
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app pub date -
Sep 7, 1999
filing date -
Oct 28, 1996
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Abstract
A higher order beryllium-nickel-copper alloy a process for making the same, and an article of manufacture comprising the alloy, the alloy being represented by the formula (0.15-0.5% Be)+(0.40-1.25% Ni)+(0-0.25% Sn)+[0.06-1% Zr) and/or (0.06-1% Ti)], the balance copper, where the sum of % Zr and % Ti is generally within a range of 0.06% and 1%, the alloy being characterized by improved electrical conductivity, bend formability and stress relaxation resistance without sacrificing strength.
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