Multi-layer plated lead frame
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United States of America Patent
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Nov 21, 2000
Grant Date -
N/A
app pub date -
Feb 19, 1998
filing date -
Feb 20, 1997
priority date (Note) -
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Abstract
A multi-layer plated lead frame is provided. The lead frame has a structure in which a first precious metal plating layer, an intermediate plating layer, and a second precious metal plating layer are sequentially formed on a substrate made of ferroalloy. The lead frame shows improvement in all properties including wire bonding, anti-corrosion, and solderability.
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