Weld bonding method
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United States of America Patent
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Nov 14, 2000
Issued Date -
N/A
app pub date -
Oct 21, 1997
filing date -
Oct 28, 1994
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The present invention is a weld bonding method providing adhesion by both an adhesive and resistance spot welding, and includes application of an adhesive including a thermosetting epoxy resin, a latent curing agent and 1 to 15 vol % of one or more additives selected from the group consisting of conductive metals, metal oxides, metal carbides, metal nitrides, metal borides, and metal silicides, which are in the from of powder having a particle size of 10 .mu.m or less, or in the form of fragments or flakes having a thickness of 0.5 .mu.m or more and a size of 30 .mu.m or less.
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