Rapid prototyping method for minimizing post processing
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
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Nov 14, 2000
Grant Date -
N/A
app pub date -
Oct 26, 1998
filing date -
Jul 10, 1998
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A method for rapid prototyping including generating cutting data including generating a support structure, deriving a silhouette curve, slicing three dimensional data into two dimensional sectional data, generating bridges for every island in the two dimensional sectional data, and generating cutting data and grouping the cutting data into first and second cutting data groups. The method also includes building a part in which an adhesive sheet is used as bond layers which includes cutting the adhesive sheet according to the first cutting data in which a perimeter of excess adhesive sheet region is cut to provide excess adhesive sheet material, peeling of backing paper of the adhesive sheet in which the excess adhesive sheet material is removed with the peeled backing paper, providing and lifting a platform in which the cut adhesive sheet is fed to a previously-built part, bonding in which the fed sheet is bonded to the previously-built part, cutting the bonded adhesive sheet according to the second cutting data in which remaining adhesive sheet edges are cut, lowering the platform, and post processing where the support structure and ridges are removed to form the built part.
First Claim
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Family
Country | kind | publication No. | Filing Date | Type | Sub-Type |
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- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
- REPUBLIC OF KOREA (MANAGEMENT: RURAL DEVELOPMENT ADMINISTRATION);SEOUL NATIONAL UNIVERSITY INDUSTRY FOUNDATION;KOREA, REPUBLIC OF
International Classification(s)
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
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Cho, In Haeng | Seoul, KR | 81 | 881 |
# of filed Patents : 81 Total Citations : 881 | |||
Lee, Kun Woo | Seoul, KR | 11 | 291 |
# of filed Patents : 11 Total Citations : 291 |
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Patent Citation Ranking
- 8 Citation Count
- B32B Class
- 3.14 % this patent is cited more than
- 25 Age
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Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
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Fee | Large entity fee | small entity fee | micro entity fee |
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Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
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