Miniature low cost modular assembly package and method of assembly
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United States of America Patent
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Oct 17, 2000
Grant Date -
N/A
app pub date -
Jun 1, 1998
filing date -
Jun 9, 1997
priority date (Note) -
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Abstract
A modular miniature circuit built entirely within the case of the module without a primary printed circuit board conventionally used as a bottom support for the circuit component. The circuit components are mounted on the inside of the case and the leads of the components are attached directly to the module's terminals, greatly reducing lead inductance. The elimination of the primary PC board results in a substantial reduction in cost and physical size and the reduction in lead lengths results in a significant enhancement of high frequency performance. The 'flip chip' construction provides a flat surface for pick up by automatic assembly equipment without the added cost of a cover.
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