Vacuum sputtering apparatus
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United States of America Patent
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Oct 17, 2000
Grant Date -
N/A
app pub date -
Jan 5, 2000
filing date -
Sep 5, 1997
priority date (Note) -
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status (Latency Note)
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Abstract
A vacuum sputtering apparatus (1) is described in which a target (7) having a target face (8) is mounted in a vacuum chamber (2) opposite a substrate (15). A magnetic pole plate (16) having a non-magnetic carrier plate (17) attached thereto is mounted behind the target (7) on a shaft (28) and can be rotated by means of a motor (29) about an axis substantially orthogonal to the target face (8). Carrier plate (17) has an array of holes (19) each of which can receive a corresponding first bar magnet (20, 21). There are fewer magnets (20, 21) than there are holes (19) and the magnets (20, 21) are removable from their holes (19). Carrier plate (17) also has a circumferential line of holes (22), in each of which may be mounted a corresponding second bar magnet (23). By varying the number and positions of the bar magnets (20, 21, 23) in the holes (19, 22) a variety of different high density plasma zone shapes (24; 25, 26; 27; 28) can be produced upon the target face (8). Conveniently, the bar magnets (20, 21, 23) are round in section but can alternatively be of square or hexagonal section, if desired.
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