Test apparatus for printed circuit board and assembly kit therefor
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Oct 10, 2000
Grant Date -
N/A
app pub date -
Nov 30, 1998
filing date -
Aug 25, 1997
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An apparatus for testing integrity of a printed circuit board is provided which employs a probe with moveable and/or fixed needle portions at its ends and a flange, probe retention boards having apertures for sliding the probe through, an interface board disposed parallel to the probe retention boards. The flange is disposed between the retention boards and the interface board. The needle portion provided away from the interface board comes in contact with the printed circuit board for testing. No socket is used in the apertures for accommodating the probe in the apertures. An assembly kit including these parts are provided for assembly by a user.
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