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Abstract

A laser bean machining apparatus, which includes a laser beam source and an irradiation observation unit for irradiating a laser beam at a desired position on a board mounted on a stage, includes a laser beam attenuator for controlling the energy of the laser beam, a polarization direction rotator for rotating the direction of the linearly polarized light of the laser beam, and a circularly polarizing converter for changing the linearly polarized light of the laser beam to circularly polarized light, and carries out energy control of the laser beam while making the polarization state of the laser beam optimum with respect to the shape of machining when the wire cutting and wire joining on the liquid crystal board are performed. For example, when surface machining is performed on the liquid crystal board, in the elongated shape machining, the linear polarization direction of the laser beam is aligned with the lengthwise direction, and in the small square shape machining, the laser beam is converted into circularly polarized light. Also, in the cutting and joining on a liquid crystal panel through a polarizing plate, energy control is carried out while always aligning the polarized light of laser beam with the polarization direction of the polarizing plate of the liquid crystal panel.

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First Claim