Process for producing electronic devices
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United States of America Patent
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Oct 3, 2000
Grant Date -
N/A
app pub date -
Feb 25, 1998
filing date -
Feb 27, 1997
priority date (Note) -
Expired
status (Latency Note)
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Abstract
There is disclosed a process for producing electronic devices from a semiconductor wafer. The process comprises forming separation regions with a spatial pattern on the semiconductor wafer to provide separation between electronic devices, and depositing a conductive contact layer on the wafer and patterning the contact layer in such a way that conductive terminals extend from the front side of the wafer over at least part of the cross section of the patterned separation regions. The terminals are bared by removing material of the wafer in the semiconductor regions starting from the backside of the wafer, and the terminals of adjacent electronic devices are separated.
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