Method for manufacturing resin-molded semiconductor device
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Oct 3, 2000
Grant Date -
N/A
app pub date -
Jun 26, 1998
filing date -
Jun 27, 1997
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
According to the present invention, a method for manufacturing a resin-molded semiconductor device by interposing a sealing sheet within a molding die for encapsulating a lead frame, on which a semiconductor chip has been bonded, with a molding compound, is provided. In adhering the sealing sheet to the lead frame and encapsulating the lead frame with the molding compound, tension is applied to the sealing sheet.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully