Apparatus and method for planarization of spin-on materials
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United States of America Patent
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Sep 26, 2000
Grant Date -
N/A
app pub date -
Oct 6, 1997
filing date -
Oct 6, 1997
priority date (Note) -
Expired
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Abstract
An improved and new apparatus and process for planarization of spin-on materials has been developed. The key features of the apparatus and the process are an enclosure surrounding the spin-on table and substrate and the application of a planarization pressure plate to the substrate, subsequent to dispersal of the spin-on materials and during rotation of the substrate.
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