Gas flow controlling device and soldering apparatus using same

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United States of America Patent

PATENT NO 6116491
SERIAL NO

09006998

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A gas flow controlling device including a housing having a gas inlet and a gas outlet and defining therewithin a gas flow passage diverging in the direction from the inlet to the outlet so that the cross-sectional area of the gas flow passage increases from the inlet to the outlet, and a plurality of spaced apart baffle plates provided in the gas flow passage to render the gas flow passage meandering. An apparatus for soldering an article, including a wave-soldering zone for contacting the article with a solder wave, and one or more above-mentioned gas flow controlling devices for establishing an inert gas atmosphere in the soldering zone.

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Patent Owner(s)

Patent OwnerAddress
NIHON DEN-NETSU KEIKI CO LTD27-1 SHIMOMARUKO 2-CHOME OHTA-KU TOKYO

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Katoh, Toshimitsu Yokohama, JP 1 22

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