Thermally conducting materials and applications for microelectronic packaging
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Sep 5, 2000
Grant Date -
N/A
app pub date -
Jul 7, 1998
filing date -
Jul 10, 1997
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A conductive paste structure is is disclosed which is a combination of a polymeric material and particles, e.g. Cu, having a thermally conductive coating, e.g. Sn. Heat is applied to fuse the coating of adjacent particles. The polymeric material is a thermoplastic. The conductive paste structure is disposed between two thermally conductive surfaces, e.g.chip and substrate pads, to provide thermal interconnection and adhesion between their pads.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully