Functionally graded metal substrates and process for making same
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United States of America Patent
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Sep 5, 2000
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N/A
app pub date -
Sep 4, 1998
filing date -
Sep 4, 1998
priority date (Note) -
Expired
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Abstract
The invention provides for a functionally-graded metal substrate that is made of at least two metal compositions, a functional insert and a surrounding body that surrounds the functional insert. In a preferred embodiment of the invention a functional insert powder composition of loose powder metal is placed in a compact of a surrounding body powder composition and both metal compositions are sintered in a sintering furnace to form a sintered part. The sintered part is infiltrated in part or in whole with a molten metal compound to produce a functionally graded metal substrate having a density of at least 90% of theoretical. A heat-generating component such as a chip can be attached to the metal substrate for use in microelectronic packaging. When the functionally-graded metal substrate has two discrete compositions of copper/tungsten the surrounding body which has a CTE that ranges from about 5.6ppm/.degree. C. to about 7 ppm/.degree. C. constrains the expansion of the functional insert which has a thermal conductivity that ranges from about 200 W/mK to about 400 W/mK.
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