Method of forming thick film pattern and material for forming thick film pattern
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United States of America Patent
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-
Sep 5, 2000
Issued Date -
N/A
app pub date -
Jun 22, 1998
filing date -
Jan 25, 1990
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A female mold (2, 12, 22, 32, 42, 52, 62) having a desirable pattern is formed on a substrate (1, 11, 21, 31, 41, 51, 61). Next, ceramic material (3, 13, 23, 33, 43, 53, 63) is filled in spaces in the female mold. Thereafter, the female mold is removed by heating the entire substrate, whereby a desirable thick film pattern can be finely and easily formed. The inorganic paste material comprising inorganic liquid vehicle containing water glass as main ingredient and powdery solid dispersed in the inorganic liquid vehicle is used as the ceramic material. The volume change of the inorganic paste material is small during the drying and calcinating processes, thus the inorganic paste material is prevented from being broken.
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