Electrical interconnect using low melting point liquid metals
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United States of America Patent
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Sep 5, 2000
Grant Date -
N/A
app pub date -
Oct 9, 1998
filing date -
Oct 10, 1997
priority date (Note) -
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Abstract
An electrical interconnect incorporating the invention includes a first conductive electrode having a male connector part; a second electrode having a female connector part closely coupled to the male connector part so as to create opposed surface regions of area A for electrical conduction therebetween; and a fusible alloy layer of maximum thickness t, positioned within the area A and between the male electrical part and the female electrical part, the fusible alloy having a resistivity that is greater than a resistivity of either the first electrode or the second electrode. A ratio of t to A assures that the resistance of the fusible alloy layer is smaller than the resistance of either the first electrode or the second electrode.
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