Thickness measuring apparatus using light from slit

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United States of America Patent

PATENT NO 6111649
SERIAL NO

09415264

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The apparatus for measuring the thickness of an object being measured has a first position measuring unit for measuring the position of a first surface of the object, a second position measuring unit for measuring the position of a second surface of said object opposite to said first surface, and a thickness obtaining portion for obtaining the thickness of the object on the basis of the position of the first surface determined by said first position measuring unit and the position of the second surface determined by the second position measuring unit. The thickness obtaining portion includes a light source for irradiating slit light on the second surface of the object by obliquely projecting light through a slit, an image pick-up portion having an image pick-up surface opposed to the progressing direction of the reflected slit light from the second surface of the object in order to pick up the reflected slit light to produce the video signal of the slit light, an analog/digital converter for converting the video signal from the image pick-up portion into a digital signal to produce digital image data of the reflected slit light, and a position obtaining section for obtaining the position of the second surface of the object on the basis of the image data of the reflected slit light from the analog/digital converter.

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Patent Owner(s)

Patent OwnerAddress
HITACHI DENSHI KABUSHIKI KAISHA23-2 KANDA SUDA-CHO 1-CHOME CHIYODA-KU TOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hirokawa, Satoshi Kodaira, JP 11 256
Nogami, Masaru Kodaira, JP 5 208
Tominaga, Tamotsu Akishima, JP 13 344

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