Semiconductor device
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United States of America Patent
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Aug 22, 2000
Grant Date -
N/A
app pub date -
Nov 30, 1998
filing date -
Dec 22, 1997
priority date (Note) -
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status (Latency Note)
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Abstract
A semiconductor device according to the invention of the present application comprises a base material having a surface on which conductive circuits are formed, a resist film for covering the base material in a state in which peripheral portions of the base material and portions of the conductive circuits are bare, a semiconductor elemental device mounted on the base material and connected to the bare portions of the conductive circuits and electrodes thereof, and a sealing body for sealing the semiconductor elemental device in an area including a range from the resist film for covering the base material to the bare portions. Owing to the provision of the resist in the exposed state of the portions of the base material, the sealing body and the base material are firmly bonded to one another therebetween so that they can be restrained from peeling.
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