Chip-contacting method requiring no contact bumps, and electronic circuit produced in this way
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United States of America Patent
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-
Aug 22, 2000
Grant Date -
N/A
app pub date -
May 18, 1998
filing date -
Aug 10, 1995
priority date (Note) -
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Abstract
In a contact-bumpless chip contacting method for contacting a chip having a plurality of conductive contact areas, which are not provided with an additional metallization layer, a carrier substrate is provided, which has a first surface having arranged thereon a plurality of conductive connecting sections. A non-conductive adhesive layer is arranged on the first surface of the carrier substrate and subsequently, the carrier substrate is aligned with the chip to be contacted such that a plurality of conductive contact areas on the chip to be contacted is in alignment with the connecting sections on the first surface of the carrier substrate. Then the carrier substrate is connected to the chip to be contacted by means of the adhesive layer in such a way that the connecting sections of the carrier substrate and the contact areas of the chip abut on one another by means of pressure contact, without any intermetallic connection being established.
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