Method and device for analysis of flip chip electrical connections
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Aug 22, 2000
Grant Date -
N/A
app pub date -
Jun 5, 1998
filing date -
Jun 5, 1998
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An alternative method and device for accessing the circuit region on a flip chip die are provided. The new method and device provide increased accuracy for accessing the electrical contacts within the circuit region. Such a method and device is necessary in order to analyze and resolve flaws among the electrical contacts between a flip chip die and the chip package. The new method and device is precise enough to avoid adding defects upon approach to the contact intended for analysis. Specific regions of the electrical contact can be isolated for study. The technique is equally efficient for mass fabrication design testing and analysis.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully