Molding apparatus with charge overflow
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Aug 22, 2000
Issued Date -
N/A
app pub date -
Mar 11, 1998
filing date -
Aug 30, 1995
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A transfer/injection molding apparatus is defined that includes a charge forming unit, a molding unit and a charge overflow unit. The charge is formed so that the fibers therein are randomly oriented in substantially parallel horizontal planes such that they are always substantially parallel to the direction of initial flow into the cavity of the molding unit. Excess charge from the cavity is forced into the charge overflow unit, which is selectively located in an area where surface finish is less critical. The excess charge displaces an overflow pin, which is kept upwardly biased, under molding pressure, to be flush with the lower inside wall of the molding unit cavity.
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Patent Citation Ranking
- 13 Citation Count
- B29C Class
- 51.77 % this patent is cited more than
- 25 Age