Thermoelectric module and method of manufacturing the same
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United States of America Patent
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Aug 15, 2000
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app pub date -
Jun 29, 1998
filing date -
Jun 29, 1998
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Abstract
A thermoelectric module contains a P-type semiconductor element and an N-type semiconductor element electrically connected in series to each other in a circuit containing a conductor and a solder layer. The solder is formed from a ternary eutectic alloy composition containing bismuth in an amount of from 5 to 70 atomic %, tin in an amount of from 20 to 70 atomic % and antimony in an amount of from 5 to 70 atomic %. The solder composition provides the thermoelectric module with improved high temperature performance and enables the semiconductor elements to be directly contacted with the soldering layer without the necessity of a barrier layer.
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