Molding overflow feedback method

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United States of America Patent

PATENT NO 6103150
SERIAL NO

09038316

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An automated method for controlling the amount of charge introduced in a mold having a mold cavity and associated overflow assembly by adjusting the amount of charge introduced into the mold cavity in subsequent moldings using a measurement of the amount of excess charge material received by the overflow assembly. The charge is formed so that the fibers therein are randomly oriented in substantially parallel horizontal planes such that they are always substantially parallel to the direction of initial flow into the cavity of the molding unit. Excess charge from the cavity is forced into the charge overflow unit, which is selectively located in an area where surface finish is less critical. The excess charge displaces an overflow pin, which is kept upwardly biased, under molding pressure, to be flush with the lower inside wall of the molding unit cavity. The pin displacement is measured by a sensing transducer. The measurement data is sent to a microprocessor, which progressively sends adjustment signals to the charge forming unit, so that the size of the subsequently cut strips can be efficiently determined.

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Patent Owner(s)

Patent OwnerAddress
THYSSENKRUPP BUDD COMPANY3155 WEST BIG BEAVER ROAD TROY MI 48084

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
McDougall, Malcolm K Sterling Heights, MI 5 109

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