Bond head having dual axes of motion
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Aug 15, 2000
Grant Date -
N/A
app pub date -
Jul 10, 1998
filing date -
Jul 10, 1998
priority date (Note) -
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status (Latency Note)
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Abstract
A bond head is provided for a wire bonding machine having a linear axis frame, a rotary axis frame, a bond tool and a wire clamp. The linear axis frame is vertically linearly displacable along a linear axis, while the rotary axis frame is rotationally displacable along a rotary axis. A pivotal connector is provided which pivotally connects the rotary axis frame to the linear axis frame, enabling the rotary axis frame to rotate independent of linear displacement of the linear axis frame. The bond tool is connected to the rotary axis frame and is vertically linearly displacable in response to vertical linear displacement of the linear axis frame and rotationally displacable in response to rotational displacement of the rotary axis frame. The wire clamp is connected to the linear axis frame and is vertically linearly displacable in response to vertical linear displacement of the linear axis frame, while the wire clamp is maintained rotationally stationary during rotational displacement of the rotary axis frame. The bond head also includes a linear motion assembly and a rotary motion assembly. The linear motion assembly has a linear driver, a linear position detector and a linear driver controller. The rotary motion assembly correspondingly has a rotary driver, a rotary position detector and a rotary driver controller.
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