Packing band, packing method and packing apparatus, of little parts, and mounting method of electronic parts

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United States of America Patent

PATENT NO 6101790
SERIAL NO

09113887

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The band 10 which stores little parts 20 in many storing dents 14 arranged along a longitudinal direction and packs the little parts 20 by covering surfaces of the storing dents 14 with a cover tape 30, and is made of a flexible material having a compress-forming nature, and comprises storing dents 14 which are compress-formed from a surface to a fixed depth in a thickness direction.

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Patent Owner(s)

Patent OwnerAddress
MATSUSHITA ELECTRIC INDUSTRIAL CO LTDJAPAN
NISSHO CORPORATION9-3 HONJO-NISHI 3-CHOME KITA-KU OSAKA-SHI OSAKA-FU

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Asao, Yukihiko Kasugai, JP 4 32
Itemadani, Eiji Sakai, JP 18 257
Mori, Kazuhiro Katano, JP 84 1130
Tanaka, Souhei Neyagawa, JP 43 705
Tomii, Uzo Ikoma-gun, JP 3 31
Uotsu, Yozo Nishinomiya, JP 2 26

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Patent Citation Ranking

  • 19 Citation Count
  • B65D Class
  • 39.01 % this patent is cited more than
  • 25 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges26560448214113613218894901 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 8081 - 9091 - 100100 +0255075100125150175200225250275300325350375400425450475500525550575600

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