Microchannel-element assembly and preparation method thereof
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United States of America Patent
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Aug 8, 2000
Grant Date -
N/A
app pub date -
Aug 6, 1998
filing date -
Aug 6, 1998
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A preparation method for an integrated assembly of a microchannel and an element is disclosed. In the preparation method of this invention, an element is prepared between a substrate and a sacrificial layer. Two protection layers, which are resistant to etchant for said substrate and said sacrificial layer, are prepared to isolate said element from its ambient environment. Said sacrificial layer defines an area to be etched off such that a microchannel may be formed. A coating layer with etching windows is then prepared on said sacrificial layer and the assembly is etched in an etchant to etch off said sacrificial layer and an area of said substrate beneath said sacrificial layer. An integrated assembly of a closed microchannel and an element is then accomplished. In the invented method, no bonding process is necessary and the integrated assembly so prepared has a planarization surface. This invention also disclosed a microchannel-element assembly prepared under the method of this invention.
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Patent Citation Ranking
- 168 Citation Count
- H01L Class
- 98.23 % this patent is cited more than
- 25 Age