Semiconductor device having adhesive between lead and chip
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United States of America Patent
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Aug 1, 2000
Grant Date -
N/A
app pub date -
Jan 12, 1998
filing date -
Jan 16, 1997
priority date (Note) -
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status (Latency Note)
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Abstract
Disclosed is a packaged semiconductor device, e.g., of the lead-on-chip type, having reduced thickness, by providing only an adhesive (without a base film) between inner lead portions of the leads and the semiconductor chip to adhere the inner-lead portions to the chip. The adhesive can cover a dicing area of the semiconductor chip, and, in general, can cover edge parts of the chip (and extend beyond the edge of the chip) to prevent short-circuits between the inner lead portions and the semiconductor chip. The outer lead portions have a lower outer end part and a part, closer to the package body, which extends upward obliquely; has stopper members on the obliquely extending part; and has an obliquely extending part with a greater width than a width of the outer end parts of the outer lead portions, to facilitate stacking of packaged semiconductor chips on each other, e.g., for mounting on a printed circuit board. Packaged semiconductor chips having, e.g., outer lead portions with a part that extends upward obliquely, can be mounted on opposed sides of a printed circuit board while facing in the same direction, thereby simplifying wiring of the device.
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