HF housing
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United States of America Patent
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-
Jul 25, 2000
Grant Date -
N/A
app pub date -
Sep 24, 1998
filing date -
Sep 27, 1997
priority date (Note) -
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status (Latency Note)
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Abstract
The invention relates to a HF housing comprising an arrangement for electrically interconnecting at least two HF conductor tracks (18, 19) which are formed on adjacent printed circuit boards (13, 15), which are separated from each other by a slit (17), and whose ends are situated opposite each other in the region of the slit. A simple way of interconnecting the conductor tracks (18, 19) situated opposite each other in the slit region is achieved in accordance with the invention by an auxiliary printed circuit board (20) which bridges the slit region and is pressed against the printed circuit boards (13, 15), the lower side of said auxiliary printed circuit board being provided with auxiliary contact bridges (21) in the region of the HF conductor tracks (18, 19) to be interconnected.
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