Bonding process
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United States of America Patent
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Jul 25, 2000
Grant Date -
N/A
app pub date -
Nov 24, 1997
filing date -
May 26, 1995
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The proposed process for bonding together two substrates with an anhydrous or low-water-content partially crystalline adhesive which is solid at room temperature is characterized in that the adhesive is first activated by internal and/or external friction. The substrates are then joined together with the adhesive between them. When allowed to stand, the structure attains its final strength after a period of between a few seconds to a few days. The friction destroys the crystalline structure and causes the adhesive to become gluey, and re-crystallization gives it its final strength and eliminates the gluey quality. The adhesive is based preferably on polyester or polyurethane and used preferably in the form of a gum stick without impermeable packaging. It is especially suitable for bonding paper, since it does not cause corrugation.
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