Holder for flat subjects in particular semiconductor wafers
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United States of America Patent
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-
Jul 25, 2000
Grant Date -
N/A
app pub date -
Dec 8, 1998
filing date -
Dec 16, 1997
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A holder for flat subjects, in particular semiconductor wafers, in particular in a device for the chemical-mechanical polishing of semiconductor wafers, with a plate-like head which can be connected on the upper side to a height adjustable spindle and at the lower side comprises a holding plate which is coupled to a carrier section arranged above the holding plate via a universal joint and which comprises a number of vertical bores which extend to the lower side of the plate and can be connected to a vacuum and/or a fluid source, wherein the holding plate is height adjustably guided in the carrier section, between the carrier section and the holding plate there is arranged an annular closed membrane within which there is formed an essentially air-tightly closed inner space which can be selectively connected to atmosphere or vacuum or to a pressure source.
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