Plastic package, semiconductor device, and method of manufacturing plastic package
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Jul 11, 2000
Grant Date -
N/A
app pub date -
Mar 25, 1998
filing date -
Mar 25, 1997
priority date (Note) -
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Abstract
Disclosed is a plastic package for storing a chip, the plastic package being further improved in moisture resistance and reduced in manufacturing costs. The plastic package comprises a plastic package body for storing a chip and a lead electrically connected with the chip, wherein an oxide layer is formed on the surface of a part of the intermediate portion of the lead, the part of the intermediate portion being allowed to adhere to a plastic.
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