Lead-free tin alloy
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United States of America Patent
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Jul 11, 2000
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N/A
app pub date -
Jan 28, 1998
filing date -
Jan 29, 1997
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Abstract
A lead-free tin alloy for solder joints comprising up to 0.25% by weight of indium and a grain refiner which is an alloy consisting of, by weight, 2.5 to 10% aluminium, 1 to 5% magnesium and balance zinc. The alloys have improved mechanical properties, such as creep strength, and an improved thermal fatigue strength.
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