Heat-resistant releasable film and process for forming the film
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United States of America Patent
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Jul 4, 2000
Grant Date -
N/A
app pub date -
Dec 1, 1997
filing date -
Jun 1, 1995
priority date (Note) -
Expired
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Abstract
A heat resistant, mold releasing coating characterized in: (a) that it comprises a layer A formed to cover the surface of the base material to be coated, wherein the coating layer forming components thereof comprise 20 to 95% by weight of frit and 5 to 80% by weight of at least one heat resistant resin selected from the group consisting of fluoro resins, silicon based resins, aromatic polysulfone resins, poly(phenylenesulfide) resins, polyamideimide resins and polyimide resins, and (b) that it comprises a layer B formed to cover the surface of said layer A, wherein the coating layer forming components thereof comprise 20 to 100% by weight of one or more fluoro resins, 0 to 20% by weight of frit, and 0 to 80% by weight of at least one heat resistant resin selected from the group consisting of silicon based resins, aromatic polysulfone resins, poly(phenylenesulfide) resins, polyamideimide resins and polyimide resins.
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