Method for molding and vulcanizing of rubber
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United States of America Patent
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Jul 4, 2000
Issued Date -
N/A
app pub date -
Jun 14, 1993
filing date -
Jun 5, 1989
priority date (Note) -
Expired
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Abstract
A method for molding a rubber compound concurrently with vulcanizing thereof utilizing the technique of high or very high frequency dielectric heating. An apparatus for molding the rubber compound concurrently with vulcanizing thereof is composed of a high voltage power source, a vacuum tube where electric waves are generated, a pair of electrode plates, and a mold having, sulfur corrosion resistance. The power source, vacuum tube and electrodes plates are electrically interconnected. The mold is attached to the electrode plates and holds the rubber compound. The rubber compound is formed of a rubber material and other constituents to raise the value of dielectric loss factor of the rubber to more than 0.20. The waves generated are determined in the HF (high-frequency) or VHF (very high-frequency) band range for effectively carrying out dielectric heating.
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