Polishing machine
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United States of America Patent
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-
Jun 27, 2000
Grant Date -
N/A
app pub date -
Jul 14, 1998
filing date -
Mar 6, 1998
priority date (Note) -
In Force
status (Latency Note)
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Abstract
The polishing machine of the present invention is capable of improving flatness of work pieces. In the polishing machine, a carrier is formed into a thin plate having a through-hole in which a work piece is accommodated. An upper polishing plate polishes an upper face of the work piece. A lower polishing plate pinches the work piece with the upper polishing plate and polishes a lower face of the work piece. A driving mechanism moves the carrier along a circular orbit in a plane without revolving. With this structure, the upper and lower faces of the work piece, which has been pinched between the polishing plates, are polished by the polishing plates.
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