Test apparatus
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United States of America Patent
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Jun 20, 2000
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N/A
app pub date -
Nov 20, 1998
filing date -
Nov 20, 1997
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Abstract
Apparatus for testing electrical bonds of a semiconductor device includes a cantilever arm (14a) with a test head (16) mounted thereon. The test head (16) is biased by the arm (14a) against a base plate (11), but can be moved away from the base plate (11) by an air bearing (22) to ensure substantially frictionless initial positioning. Sensing means (32;34) for sensing contact with a semiconductor substrate are also disclosed.
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