Lead frame structure for preventing the warping of semiconductor package body
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United States of America Patent
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Jun 20, 2000
Grant Date -
N/A
app pub date -
Feb 16, 1999
filing date -
Nov 20, 1998
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A lead frame structure can prevent the warping of a semiconductor package body. The lead frame has a downset die pad and upset internal leads so that packaging material can be evenly distributed both above and below the lead frame.
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