Device having resin package with projections
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Jun 6, 2000
Grant Date -
N/A
app pub date -
Nov 6, 1996
filing date -
Nov 8, 1995
priority date (Note) -
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Abstract
A device includes a chip, and a resin package sealing the chip, the resin package having resin projections located on a mount-side surface of the resin package. Metallic films are respectively provided to the resin projections. Connecting parts electrically connect electrode pads of the chip and the metallic films.
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